Tactile switch SMT3/SMTE3
- ●To make a purchase, contact Distributors, or use e-commerce below.
SALES CHANNEL ;Check our Distributors.- SALES CHANNELClick here to check our Distributors.
Surface Mount Tactile Switches
- Compatible With Lead-Free, Reflow Soldering
Heat-resistance resin for lead-free soldering. - Washable (SMTE3 Series)
- J-Lead Terminal Pins For High-Density Mounting
- Anti-Static Electricity (SMTE3 Series)
Ground terminal is provided to prevent damage to element caused by static electricity.
◆Structure
Specifications
| Rating Max. | 0.6VA max. (24VDC max. 30mA max.） |
|---|---|
| Rating Min. | Silver plated contacts 1mA 5VDC（Resistive load） Gold plated contacts 10μA 5VDC（Resistive load） |
| Initial contact resistance | 100mΩ max.(1.5mA 200μVAC) |
| Dielectric strength | A250VAC 1 minute |
| Insulation resistance | 100MΩ min. (100VDC) |
| Electrostatic capacity | 5pF max. |
| Electrical life | 100,000 operations |
| Stroke | SMT3：0.25mm SMTE3：0.5mm |
| Operating force | SMT3：1.18±0.39 N SMTE3：1.96±0.98 N |
| Operating temperature range | －25～＋70℃ |
| Storage temperature range | －40～＋85℃ |
Part number designation
| SMT | E | G | 3 - | 01 | E- | Z |
|---|---|---|---|---|---|---|
|
Series code None:Standard type (Plastic button) Immersion washable (Rubber button) |
Structure |
Contact plating None:Silver plated |
Series No. |
Registration No. |
Packaging specs. None: Stick |
List of part numbers
| Part Number | Structure | Packaging | CAD |
|---|---|---|---|
| SMT3-01-Z | Standard type(Plastic button) | Stick | |
| SMTE3-01-Z | Immersion washablee(Rubber button) | Stick | |
| ★SMTEG3-01-Z | Immersion washablee(Rubber button) | Stick | |
| SMT3-01E-Z | Standard type(Plastic button) | Emboss taping | |
| ★SMTG3-01E-Z | Standard type(Plastic button) | Emboss taping | |
| SMTE3-01E-Z | Immersion washablee(Rubber button) | Emboss taping | |
| ★SMTEG3-01E-Z | Immersion washablee(Rubber button) | Emboss taping |
Outline Dimensions
(Unit:mm)
Pad Layouts
Soldering Specifications
- Manual Soldering
Device : Soldering iron
①350°C ± 10°C; 3 ± 0.5 seconds - Reflow Soldering
Device : Inline or batch system
・Apply reflow soldering up to 2 times max.
Flux Cleaning
※Since the SMT3 series is not process sealed, be sure to use low-residue flux.
- Solvent: Fluorine or Alcohol type Cleaning with other solvents or water is not possible.
- Cleaning after soldering should be done after the terminal temperature falls to 90°C or below, or after leaving the switch for five minutes or longer at room temperature. Cleaning temperature: 43°C, max.
- Do not use ultrasonic cleaning.
Packaging Specifications
(Unit:mm)
| Stick specification | Emboss taping specification |
|---|---|
|
|
|
Minimum packaging quantity for reel packaging is 1,000pcs per reel.
Documents
Environmental Data
- ●The above contents and descriptions are subject to change without notice.
Products
