Pushbutton switch SMAP
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Surface Mount Pushbutton Switches
FeaturesFeatures
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Compatible with Reflow Soldering
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Washable
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Gold-Plated Contacts for Low Current Application
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Clip Contact Mechanism for High Contact Reliability
Specifications
Rating Max. | 0.4VA( 28VDC max.)(Resistive load) |
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Rating Min. | 1μA 20mVDC(Resistive load) |
Initial contact resistance | 100mΩ max.(1.5mA 200 μVAC) |
Dielectric strength | 250VAC 1minute |
Initial insulation resistance | 500MΩ min.(250VDC) |
Stroke | 1.4mm |
Operating force | 1.47±0.98 N |
Electrostatic capacity | 5pF max.(AC voltage of 1M ± 200 Hz) |
Electrical life | 10,000 operations at max. rating 30,000 operations at min. rating |
Switch timing | Non-shorting |
Operating temperature range | -20~+80℃ |
Storage temperature range | -40~+80℃ |
Part Number Designation
SMAP | 1 | F - | 2 | M | - E | - Z |
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Series |
No. of poles 1: 1 pole 2: 2 poles |
SW function F: ON-(ON) |
Terminals 2: PC straight 5: R/A |
Actuator shape M: Standard |
Packaging Blank: Stick E: Emboss taping |
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List of Part Numbers
Part No. | No. of poles | SW function | Terminal | Packaging | Pieces in package | CAD |
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Part No.:SMAP1F-2M-Z | 1 pole | ON-(ON) | PC straight | Stick | 50 pcs./stick | |
Part No.:SMAP1F-5M-Z | 1 pole | ON-(ON) | R/A | Stick | 50 pcs./stick | |
Part No.:SMAP1F-5M-E-Z | 1 pole | ON-(ON) | R/A | Emboss taping | 500 pcs./reel |
Pad Layouts(Top view)
Circuit Diagrams
●In a single-pole configuration, terminals (C2), (3) and (4) are not connected.
Soldering Specifications
- Manual Soldering
Device:Soldering iron 380°C ±10°C; 3±0.5 seconds
- Reflow Soldering
Device:Inline or batch system
●Apply reflow soldering only once.
Flux Cleaning
- Solvent :Fluorine or Alcohol type
- Cleaning after soldering should bedone after the terminal temperature falls to 90°C or below, or after leaving the switch for five minutes or longer at room temperature.
- Do not use ultrasonic cleaning.
Documents
Environmental Data
- ●The above contents and descriptions are subject to change without notice.