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Pushbutton switch CFP2

●To buy this product, please go to the following Online Web stores.
To the Pushbutton switch “CFP2 series” page on the DigiKey online shop
To the Pushbutton switch “CFP2 series” page on the RS components online shop
To the Pushbutton switch “CFP2 series” page on the Chip1stop online shop
 To the Pushbutton switch “CFP2 series” page on the Farnell online shop
To the Pushbutton switch “CFP2 series” page on the Mouser online shop

Ultra-miniature pushbutton switch

  • Ultra-miniature pushbutton switch for high density mounting.
  • Washable.
  • Terminal pin pitch: 2.54 mm.
  • Independent detent mechanism ensures light operational feel.
  • Clip contact mechanism for long-term contact reliability.
  • Gold-plated contacts.
  • Terminal Pins: Straight 
  • Actuator Color: Gray

Specifications

Rating 0.4VA( 28VDC max.)
1μA 20mVDC
Initial contact resistance 100m Ω以下(AC200μV 1.5mA)
Dielectric strength 250VAC 1 minute
Insulation resistance 500MΩ min. ( 250VDC)
Electrical life 10,000 operations at max.rating
30,000 operations at min.rating
Mechanical life 30,000 cycles
Operating force 47±0.98 N
Operating temperature range -40~+85℃
Storage temperature range -40~+85℃

Part number designation

CFP2 -2RC4-AW

Series Actuator

P:Pushbutton

Number of poles

01: 1 bit    
02: 2 bits   

Switching function

1 pole:F /ON -(ON)

2 poles:R /ON -(ON)

Terminal style

C: P/C

C4: Right angle

C6: Vertical mounting

Actuator shape

A: Standard

Packaging

W: tray

List of part numbers

Part numberNumber of polesSwitching functionTerminal stylePackagingCAD
CFP2-1FC-AW 1 bit ON -(ON) P/C tray
CFP2-2RC-AW 2 bits ON -(ON) P/C tray
CFP2-1FC4-AW 1 bit ON -(ON) Right angle tray
CFP2-2RC4-AW 2 bits ON -(ON) Right angle tray
CFP2-1FC6-AW 1 bit ON -(ON) Vertical mounting tray
CFP2-2RC6-AW 2 bits ON -(ON) Vertical mounting tray

Outline Dimensions

(Unit:mm)

Handling Specifications

Soldering Specifications
  • Manual Soldering/Device:Soldering iron
    350℃ Max. 3 sec. Max.
  • Auto Soldering/Device:Jet wave type or dip type
    260℃ Max.3-5sec.(One time)Total dip time within 10sec.
  • Pre-heating should be done at temperatures from 80°C to 120°C and within 120 seconds
  • When soldering two or more terminals to a common land, use solder resist to separate them
Flux Cleaning
  • Solvents : Fluorine or Alcohol type
  • Cleaning after soldering should be done after the PC board is exposed to room temperature (30℃ or below) for 1 to 2 hours.
  • Do not use ultrasonic cleaning.

Packaging Specification

(Unit:mm)

Environmental Data

●The above contents and descriptions are subject to change without notice. 

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