Polymer Resettable Circuit Protector PRCP-PSMF
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Small size results in very fast time to react to fault events
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Compact design to save board space - 0805 footprint
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Small size results in very fast time to react to fault events
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Low profile
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RoHS compliant and halogen free
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Agency recognition: UL
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Electrical Characteristics
Model | Maximum Voltage (V max) | Maximum Current (I max) | at 23 ℃ | |||||
---|---|---|---|---|---|---|---|---|
Hold Current (Ihold) | Trip Current (Itrip) | R min ※1 | R1 max ※2 | Max. Time to Trip | Tripped Power Dissipation※3 | |||
PRCP-PSMF010X | 15 VDC | 40 A | 0.10 A (at 23 ℃) | 0.30 A (at 23 ℃) | 1.0 Ω※1 (at 23 ℃) | 7.5 Ω※2 (at 23 ℃) | 1.5 Sec (at 0.5 A, at 23 ℃) |
0.5 W※3 (at 23 ℃) |
PRCP-PSMF020X | 9 VDC | 40 A | 0.20 A (at 23 ℃) | 0.50 A (at 23 ℃) | 0.65 Ω※1 (at 23 ℃) | 3.5 Ω※2 (at 23 ℃) | 0.02 Sec (at 8.00 A, at 23 ℃) |
0.5 W※3 (at 23 ℃) |
PRCP-PSMF035X | 6 VDC | 40 A | 0.35 A (at 23 ℃) | 0.75 A (at 23 ℃) | 0.25 Ω※1 (at 23 ℃) | 1.2 Ω※2 (at 23 ℃) | 0.10 Sec (at 8.00 A, at 23 ℃) |
0.5 W※3 (at 23 ℃) |
PRCP-PSMF050X | 6 VDC | 40 A | 0.50 A (at 23 ℃) | 1.00 A (at 23 ℃) | 0.15 Ω※1 (at 23 ℃) | 0.9 Ω※2 (at 23 ℃) | 0.10 Sec (at 8.00 A, at 23 ℃) |
0.5 W※3 (at 23 ℃) |
PRCP-PSMF075X | 6 VDC | 40 A | 0.75 A (at 23 ℃) | 1.50 A (at 23 ℃) | 0.09 Ω※1 (at 23 ℃) | 0.35 Ω※2 (at 23 ℃) | 0.20 Sec (at 8.00 A, at 23 ℃) |
0.6 W※3 (at 23 ℃) |
PRCP-PSMF110X | 6 VDC | 40 A | 1.10 A (at 23 ℃) | 2.20 A (at 23 ℃) | 0.06 Ω※1 (at 23 ℃) | 0.21 Ω※2 (at 23 ℃) | 0.20 Sec (at 8.00 A, at 23 ℃) |
0.6 W※3 (at 23 ℃) |
Thermal Derating Chart
Model | Ambient operating temperature: Ihold / Itrip (A) | ||||||||
---|---|---|---|---|---|---|---|---|---|
-40 ℃ | -20 ℃ | 0 ℃ | 23 ℃ | 40 ℃ | 50 ℃ | 60 ℃ | 70℃ | 85 ℃ | |
PRCP-PSMF010X | -40 ℃: 0.15 / 0.45 | -20 ℃: 0.13 / 0.39 | 0 ℃: 0.12 / 0.36 | 23 ℃: 0.10 / 0.30 | 40 ℃: 0.09 / 0.27 | 50 ℃: 0.08 / 0.24 | 60 ℃: 0.07 / 0.21 | 70 ℃: 0.06 / 0.18 | 85 ℃: 0.05 / 0.15 |
PRCP-PSMF020X | -40 ℃: 0.28 / 0.70 | -20 ℃: 0.25 / 0.63 | 0 ℃: 0.23 / 0.58 | 23 ℃: 0.20 / 0.50 | 40 ℃: 0.17 / 0.43 | 50 ℃: 0.14 / 0.35 | 60 ℃: 0.12 / 0.30 | 70 ℃: 0.10 / 0.25 | 85 ℃: 0.07 / 0.18 |
PRCP-PSMF035X | -40 ℃: 0.47 / 1.01 | -20 ℃: 0.44 / 0.94 | 0 ℃: 0.39 / 0.84 | 23 ℃: 0.35 / 0.75 | 40 ℃: 0.30 / 0.64 | 50 ℃: 0.27 / 0.58 | 60 ℃: 0.24 / 0.51 | 70 ℃: 0.20 / 0.43 | 85 ℃: 0.14 / 0.30 |
PRCP-PSMF050X | -40 ℃: 0.68 / 1.36 | -20 ℃: 0.62 / 1.24 | 0 ℃: 0.55 / 1.10 | 23 ℃: 0.50 / 1.00 | 40 ℃: 0.40 / 0.80 | 50 ℃: 0.37 / 0.74 | 60 ℃: 0.33 / 0.66 | 70 ℃: 0.29 / 0.58 | 85 ℃: 0.23 / 0.46 |
PRCP-PSMF075X | -40 ℃: 1.00 / 2.00 | -20 ℃: 0.90 / 1.80 | 0 ℃: 0.79 / 1.58 | 23 ℃: 0.75 / 1.50 | 40 ℃: 0.63 / 1.26 | 50 ℃: 0.57 / 1.14 | 60 ℃: 0.53 / 1.06 | 70 ℃: 0.42 / 0.84 | 85 ℃: 0.35 / 0.70 |
PRCP-PSMF110X | -40 ℃: 1.45 / 2.90 | -20 ℃: 1.35 / 2.70 | 0 ℃: 1.20 / 2.40 | 23 ℃: 1.10 / 2.20 | 40 ℃: 0.92 / 1.84 | 50 ℃: 0.84 / 1.68 | 60 ℃: 0.75 / 1.50 | 70 ℃: 0.65 / 1.30 | 85 ℃: 0.52 / 1.04 |
Environmental Characteristics
Operating Temperature | -40 ℃ ~ +85 ℃ |
---|---|
Maximun device surface temperature in tripped state | 125 ℃ maximum |
Passive Aging | 85 ℃, 1000 h: ±5 % typical resistance change |
Humidity Aging | 85 ℃, 85 % RH, 1000 h: ±5 % typical resistance change |
Thermal Shock | -40 ℃ ~ +85 ℃, 20 cycles: ±10 % typical resistance change |
Solvent Resistance |
MIL-STD-202 method 215: No change |
Vibration | MIL-STD-883C, Method 2007.1, Condition A: No change |
MSL (Moisture Sensitivity Level) | Level 1, J-STD-020 |
Test Procedures and Requirements
Item | Test Condition | Accept / Reject Criteria |
---|---|---|
Visual/Mech. | Test condition: Verify dimensions and materials | Accept / Reject criteria: Per P.R.C.P. physical description |
Resistance | Test condition: In still air at 23 ℃ | Accept / Reject criteria: R min ≤ R ≤ R1 max |
Time to Trip | Test condition: At specified current, V max, 23 ℃ | Accept / Reject criteria: T ≤ max. time to trip (Sec) |
Hold Current | Test condition: 30 min. at Ihold , 23 ℃, still air | Accept / Reject criteria: No trip |
Trip Cycle Life | Test condition: V max, I max, 100 cycles | Accept / Reject criteria: No arcing or burning |
Trip Endurance | Test condition: V max, I max, 48 h | Accept / Reject criteria: No arcing or burning |
Solderability | Test condition: 245 ℃ ± 5 ℃, 5 seconds | Accept / Reject criteria: 95% min. coverage |
Product Dimensions
Model | A | B | C | D | |||
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Min. | Max. | Min. | Max. | Min. | Max. | Min. | |
PRCP-PSMF010X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.48 (0.019) ~ Max. 0.85 (0.033) |
0.85 (0.033) |
D:Min. 0.20 (0.008) |
PRCP-PSMF020X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.48 (0.019) ~ Max. 0.85 (0.033) |
0.85 (0.033) |
D:Min. 0.20 (0.008) |
PRCP-PSMF035X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.48 (0.019) ~ Max. 0.85 (0.033) |
0.85 (0.033) |
D:Min. 0.20 (0.008) |
PRCP-PSMF050X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.48 (0.019) ~ Max. 0.85 (0.033) |
0.85 (0.033) |
D:Min. 0.20 (0.008) |
PRCP-PSMF075X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.75 (0.030) ~ Max. 1.25 (0.049) |
1.25 (0.049) |
D:Min. 0.20 (0.008) |
PRCP-PSMF110X | A:Min. 2.00 (0.079) ~ Max. 2.30 (0.091) |
2.30 (0.091) |
B:Min. 1.20 (0.047) ~ Max. 1.50 (0.059) |
1.50 (0.059) |
C:Min. 0.75 (0.030) ~ Max. 1.25 (0.049) |
1.25 (0.049) |
D:Min. 0.20 (0.008) |
Recommended Pad layout
- Unit:
- mm
(inch)
Solder Reflow Recommendations
- PRCP-PSMF models are intended for reflow soldering (including, not limited to heating plate, hot air, IR, nitrogen, and vapor phase).
- Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source.
- Hand soldering is not recommended for these devices.
- All temperatures refer to the topside of the device, measured on the device body surface.
- If reflow temperatures exceed the recommended profile, devices may not meet the published specifications.
- Compatible with Pb and Pb-free solder reflow profiles.
- Excess solder may cause a short circuit.
Profile Feature | Pb-Free Assembly |
---|---|
Average Ramp-Up Rate (Tsmax to Tp) | 3 ℃ / Sec max. |
PREHEAT Temperature Min (Tsmin) Temperature Max (Tsmax) Time (Tsmin to Tsmax) (ts) |
150 ℃ 200 ℃ 60 ~ 180 Sec |
TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) |
217 ℃ 60 ~ 150 Sec |
Peak Temperature (Tp) | 260 ℃ |
Time within 5 ℃ of Actual Peak Temperature (tp) | 20 ~ 40 Sec |
Ramp-Down Rate | 6 ℃ / Sec max. |
Time 25 ℃ to Peak Temperature | 8 minutes max. |
Warranty
However, the following shall be excluded from the warranty:
Failure or damage caused by improper use and careless operation in violation of the catalog and specification.
The term “Warranty” herein referred to shall imply the warranty for the product unit only, and damages from failure of the product shall be excluded.
This product is not intended to be used for equipment that may cause direct harm to life or body, or equipment that may cause significant physical damage. (Aerospace and space related equipment, railway vehicles, nuclear power equipment, military equipment, etc.) We are not liable for any damages arising from the use of this product for purposes not intended by us.
Furthermore, we ask you to perform a swift incoming inspection for delivered products and we wouldalso appreciate if full attention is given to the storage conditions of the product.
Documents
Environmental Certificate
- ●The above contents and descriptions are subject to change without notice.